Industrial Storage

M.2 2280 PCIe Gen3 x4

M.2 2280 module on PCIe Gen3 x4 with NVMe protocol support. Available configurations include 128 GB–2 TB on PCIe Gen3 x4.

2400 MB/sMax Sequential Read
1650 MB/sMax Sequential Write
0 °C to 70 °COperating Temperature
128 GB–2 TBCapacity
SIMORCHIP industrial M.2 2280 PCIe Gen3 x4 solid-state drive
01

Technical Summary

InterfacePCIe Gen3 x4
ProtocolNVMe 1.4
Form FactorM.2 2280
Capacity128 GB / 256 GB / 512 GB / 1 TB / 2 TB
Sequential Readup to 2400 MB/s
Sequential Writeup to 1650 MB/s
MTBF1,500,000 hours
Operating Temperature0 °C to 70 °C
02

Key Features

  • NVMe 1.4 protocol over PCIe Gen3 x4
  • LDPC error correction
  • On-chip RAID
  • TRIM / Dataset Management and S.M.A.R.T. support
  • Firmware update and write protection
  • IQC, IPQC, FQC and OQC production quality control
03

Ordering Information

Industrial Ordering Part Numbers

Ordering P/NCapacityInterfaceDatasheet
SMC128GM28310128 GBPCIe Gen3 x4On Request →
SMC512GM28310512 GBPCIe Gen3 x4On Request →
SMC002TM283102 TBPCIe Gen3 x4On Request →

Part numbers for capacities not listed are available on request.

04

Performance & Endurance

The speeds shown above are the highest sequential read and write values in this product family. Performance varies by capacity; see the table below for the datasheet values for each capacity.

CapacitySequential readSequential writeTBW
128 GB1600 MB/s1000 MB/s75 TB
256 GB2100 MB/s1600 MB/s150 TB
512 GB2400 MB/s1650 MB/s300 TB
1 TB2400 MB/s1650 MB/s600 TB
2 TB2400 MB/s1650 MB/s1200 TB
Supported FeaturesLDPC · S.M.A.R.T. · Firmware update · Write protection · On-chip RAID · TRIM / Dataset Management
05

Mechanical Specifications

Form FactorM.2 2280
Dimensions22 × 80 × 2.2 mm
80.0 mm 22.0 mm M.2 2280 PCIe Gen3 x4
Outline drawn to scale. Dimensions in millimeters.
06

Environmental Specifications

Operating Temperature0 °C to 70 °C
Storage Temperature-40 °C to 85 °C
Supply Voltage3.3 V
07

Compatibility & Qualification

Drive selection is determined by the available bay or socket, the host interface and the board layout. Compatibility verification is performed against the applicable target configuration according to project requirements.

09

Production Verification

IQCIPQCFQCOQC

Production-level verification

  • Incoming, in-process, final and outgoing quality control
  • Firmware version verification before shipment
  • Drive functional verification before shipment

Project-level qualification

  • Target-platform compatibility verification
  • Stability verification under the defined operating conditions
  • Application-specific qualification where the program requires it

Production-level verification is part of the manufacturing flow. Project-level qualification is scoped per program.

12

Product Configuration Review

Provide the target platform, the required capacity, the host interface, operating conditions and expected program lifecycle. SIMORCHIP engineering will review the applicable drive configuration and qualification requirements.